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Submodeling Analysis for Path-Dependent Thermomechanical Problems
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In a finite element analysis, when localized behavior of a large model is of particular concern, generally one would refine the mesh until it captures the local solution adequately. Submodeling ...
Numerical Investigation of Thermal Dissipation on Quad Flat Package With Unattached Heat Spreader
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Due to cost and process considerations, sometimes a drop-in heat spreader is incorporated in a quad flat package, which is not attached to the die pad. Consequently, due to mismatch of thermal ...
Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Plane two-dimensional finite element analysis was applied to study the effect of underfill thermomechanical properties on the potential of thermal fatigue failure for flip-chip ball grid array. ...
Transient Thermal Analysis for Board-Level Chip-Scale Packages Subjected to Coupled Power and Thermal Cycling Test Conditions
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this work, thermal characteristics of a board-level chip-scale package, subjected to coupled power and thermal cycling test conditions defined by JEDEC, are investigated through the transient ...
Influence of Power Cycling Durations on Thermal and Fatigue Reliability Characteristics of Board-Level Chip-Scale Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The sequential thermal-mechanical coupling analysis, which solves in turn the transient temperature field and subsequent thermomechanical deformations, was performed in this work to investigate ...